DIELINE SUMMIT Design packaging congress

Two days to discuss the future of design packaging.

Engineering, Technology

DIELINE SUMMIT Design packaging congress 16-17 Nov 2014 Palais des congrès de Paris, Paris, France
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Launched jointly by the international EMBALLAGE exhibition and The Dieline, the first edition of "The Dieline Summit" - will be held at the Palais des Congrès in Paris on the 16th and 17th November. This one-of-a-kind forum is inspired by the theme "WHAT IS THE FUTURE OF PACKAGE DESIGN?" It is aimed at professional designers, and packaging enthusiasts, aiming to reinvent packaging design in the presence of some of the sector’s leading stakeholders.

URLs

Twitter: http://atnd.it/16191-1

Inquiries: http://atnd.it/16191-3

Facebook: http://atnd.it/16191-4

Price:
Conference Pass: €980 TTC

Speakers: IDEO, COCA COLA, LANDOR, PEARLFISHER, PANTONE, ELMWOOD, COLLINS, Andrew Gibbs

When
From: November 16, 2014 18:00
To: November 17, 2014 18:00
Where

Palais des congrès de Paris, 2 Place de la Porte Maillot, 75017, Paris, France

Category

Engineering, Technology

Contact email
Veronique.sestrieres@comexposium.com

Contact phone
+33 176771298

Website

Submitted by:

evvnt Platform

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