The Dieline Summit at Emballage

Typography. Color Theory. Case Studies. Solutions. Yes we love these topics too, but The Dieline Summit @ Emballage is different. Part Salon. Part Master Class.

16-18 Nov 2014 at Palais des congrès de Paris, Paris, France

Design, Big Ideas/Think

Submit new post
Thank you for posting.
Share it:

People (3)

Show all

The Dieline is setting out to create a different kind of package design conference: A future-forward discussion that challenges the status-quo, and inspires creators of packaging and products to help solve today’s global problems and change the world through package design. The mission is to prepare the next generation of designers and marketers by asking one simple question:

What is the future of package design?

The Dieline Summit is a global gathering of design leaders coming together to discuss the future of the package design industry, along with the issues designers, consumer packaged goods companies, marketers, consumers, and the world environment are facing.

Global businesses have begun to value designers for our ability to drive positive growth and think holistically about brand and beyond. With a shifting global economy, the business of design and the role of designers everywhere are changing. We see today as the single most exciting time in history to be a designer.

It's a time where the designer can harness these industry shifts, and expand their career leadership as more businesses are relying on the value of design.

From: November 16, 2014 18:00
To: November 18, 2014 18:00

Palais des congrès de Paris, 2 Place de la Porte Maillot, 75017, Paris, France


Design, Big Ideas/Think

Contact email

Contact phone
+1 7142109597

External link

Organized by: